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Robotic Vision Systems Shipped a Record Seven Wafer Inspection Systems in its September Quarter
OMRON Automation - Americas Posted 10/22/2004
NASHUA, NEW HAMPSHIRE -- Robotic Vision Systems, Inc. (RVSI) (OTC Bulletin Board: RVSI.OB) today said its Semiconductor Equipment Group shipped a record seven of its WS-series wafer inspection systems in the quarter ended September 30, 2004. Five separate customers took delivery of the systems.
Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold ‘‘bumps’‘ that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.
‘‘We noted that our closest competitor in this market recognized revenue on a single system during the same period, said Bob Michaels, Vice President - Sales for RVSI's Semiconductor Equipment Group in Hauppauge, NY.
‘‘We are told by our customers that our WS-series offers an unparalleled combination of 2-D surface defect inspection and 3-D metrology or bump height measurement on a single platform, and that inspection is done at a speed and with repeatability of results that meets or exceeds every requirement.’‘
Michael Gray, Vice President - Strategic Development at the Semiconductor Equipment Group, added that the market for wafer inspection is growing as semiconductor companies increasingly shift to bumped wafer and flip-chip packaging technology.
‘‘We have now approaching fifty WS-series installations representing a mix of technology buys and capacity additions,’‘ Mr. Gray said. ‘‘Of the seven systems shipped in the September quarter, two were purchased by semiconductor fabricators that are ramping up their use of bumped wafer technology. They are committed to 100% metrology inspection, and also value their WS-systems for surface defect review. The other five systems were shipped to specialty test, assembly and packaging organizations that are winning contracts to inspect these wafers as part of the assembly process. Both markets offer excellent growth prospects.’‘
Certain of the shipments described in this press release were also the subject of press releases at the time orders were received from customers.
Robotic Vision Systems, Inc. (RVSI) (RVSI.OB) has the most comprehensive line of machine vision systems available today. Headquartered in Nashua, New Hampshire, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and Data Matrix-based unit-level traceability.
Using leading-edge technology, RVSI joins vision-enabled process equipment, high-performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies.
Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's annual report on Form 10-K, and other filings with the Securities and Exchange Commission.