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RVSI Gets Two Milestone Orders for Wafer Inspection Systems
OMRON Automation - Americas Posted 02/01/2002
CANTON, MASSACHUSETTS - January 31, 2002 - Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV) today said it has received two orders for its WS-series bumped wafer inspection system. The first is from one of the world's largest microelectronics manufacturers; the second is from one of Asia's premier contract assembly houses.
The order from the microelectronics manufacturer is the first to be issued to RVSI following an extensive evaluation of RVSI's WS-series inspection system against that of RVSI's principal competitor in the field. RVSI was selected by the microelectronics manufacturer as 'best of breed' in December. The customer has indicated a requirement for up to six systems over a 24-month period.
'This order represents a critically important milestone for RVSI in its bumped wafer inspection system program,' said Frank L. Jacovino, General Manager of Wafer Level Products at the Electronics Division of RVSI in Hauppauge, New York. 'This was a side-by-side competition that was closely watched by other companies that are in the evaluation stage of determining who will supply their integrated 2-D and 3-D inspection technology. We believe the thoroughness of the evaluation process and the fact that both we and our competitor sought to win this showcase account will not go unnoticed within the industry.'
'The importance of our selection goes beyond a single order,' said Michael Gray, Vice President of Sales at the Electronics Division of RVSI in Hauppauge, New York. ' Our technology approach was determined to be the best for all phases of the flip-chip inspection process. This best-of-breed selection means we are now integrated into all aspects of the customer's quality assurance program: the WS-3000 for wafer inspection, the WS-1000 for substrates, and the LS-7700 for final assembled package inspection. We were already inspecting two of the three critical points of flip-chip processing - substrate and final package; now we are adding wafer-level inspection, the third processing point.'
The second order, from the Asian contract assembler, was also a competitive win, and helps to further establish RVSI as the de-facto standard for bumped wafer inspection among organizations that take completed wafers from device manufacturers, inspect, dice, assemble, and test integrated circuits. Such firms today account for the majority of 'back end' semiconductor manufacturing.
'This is yet another example of the WS-series inspection system being chosen because of its combination of measurement, accuracy, defect detection, and production throughput,' Mr. Jacovino said. 'Our 3-D laser technology utilized by MicroMap technology, with its inherent adaptability to measure any surface feature, allows the WS Series systems to inspect a broad variety of electrical interconnects - ; from solder or gold bumps to micro-spring wires - with unparalleled speed and accuracy.
Test/Assembly/Packaging houses such as this one require systems with maximum versatility, which in turn means higher utilization rates and greater return on investment. '
Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold 'bumps' that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps. Depending upon wafer size and other features, the WS-series is priced from $500,000 to $1 million per system.
Robotic Vision Systems, Inc. (RVSI) (NASDAQ:ROBV) has the most comprehensive line of machine vision systems available today. Headquartered in Canton, Massachusetts, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and media transfer equipment. Using leading-edge technology, RVSI joins vision-enabled process equipment, high-performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, and pharmaceutical industries, RVSI holds approximately 100 patents in a broad range of technologies.
Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's most recent registration statement, annual report on Form 10-K and 10K/A, and other filings with the Securities and Exchange Commission.
For further information contact:
Neal H. Sanders