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News

RVSI Gets Order for WS-3000 Wafer Inspection System

OMRON Automation - Americas

One of the world's premier silicon foundries will purchase a 300mm bumped
wafer inspection system

Canton,  Massachusetts -- August 22, 2002 -- Robotic Vision Systems, Inc. (RVSI) (Nasdaq: ROBV) today said it has received an order for a WS-3000 bumped wafer inspection system from one of the world's largest semiconductor foundries.  The Asian-based company plans to use the system for defect inspection and bump height metrology of 300mm semiconductor wafers.

'Wafer bumping is beginning the transition from laboratory development to mass production,' said Michael Gray, the Semiconductor Equipment Group's Vice President of Sales. 'This order is additional evidence that RVSI's combination of proprietary 3-D inspection technology and superior defect detection gives us the right tool at the right time to become the standard for production-speed wafer bumping.  As the company that has built nearly 2000 inspection systems that monitor the quality of approximately 80% of the world's integrated circuit packages, RVSI has the unique technology and support structure needed to meet the challenging demands of 100% bumped wafer inspection for mass production. We are gratified that one of the world's premier silicon foundries has chosen to place this order with us.  We believe it is a reflection of our pre-eminent place in this emerging market.'

'This customer was an early purchaser of one of our first-generation WS-series systems,' said Frank L. Jacovino, General Manager of Wafer Level Products at RVSI's Semiconductor Equipment Group in Hauppauge, New York. 'They have had an opportunity to observe the evolution of our technology from 3-D-metrology-only to a combined 2-D and 3-D defect data capture system.'

As in previous awards, RVSI was selected in direct competition with other vendors of bumped wafer inspection systems.  Delivery of the system is planned within the next 60 days.

Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold 'bumps' that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps. Depending upon wafer size and other features, the WS-series is priced from $500,000 to $1 million per system.

About RVSI
Robotic Vision Systems, Inc. (RVSI) (NASDAQ:ROBV) has the most comprehensive line of machine vision systems available today. Headquartered in Canton, Massachusetts, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and media transfer equipment. Using leading-edge technology, RVSI joins vision-enabled process equipment, high-performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, and pharmaceutical industries, RVSI holds approximately 100 patents in a broad range of technologies.

Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's most recent registration statement, annual report on Form 10-K and 10K/A, and other filings with the Securities and Exchange Commission.

Contact:
Neal H. Sanders
5 Shawmut Road
Canton, MA  02021
Tel: 781-302-2439
Fax: 781-302-2440

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