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RVSI Gets Order for 300mm Wafer Inspection System from Taiwan Chip Assembler
OMRON Automation - Americas Posted 06/11/2001
RVSI's WS-3000 system will be used to inspect "bumped" wafers; system will now be used by Taiwan's four largest subcontract manufacturers
CANTON, MASSACHUSETTS - June 6, 2001 - Robotic Vision Systems, Inc. (RVSI) (NASDAQ: ROBV) today said it has received its first order for the company's new WS-3000 Wafer Inspection System from a major Taiwan semiconductor subcontract manufacturer. The WS-3000 is designed for use with the semiconductor industry's new 300-millimeter wafers.
Rather than traditional wire bonds, the newest generation of integrated circuits utilize microscopic-sized solder or gold "bumps" that are directly deposited on the wafer for electrical connections. RVSI's new product improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system is capable of handling 300mm wafers, the largest commercially available, and inspecting pre-reflow and post-reflow solder bumps and multi-process gold bumps.
The WS-3000 combines RVSI's proprietary 3-D laser technology with 2-D high resolution, state-of-the-art cameras to achieve superior measurement throughput and performance. A sophisticated user interface and software allow for fast and easy set-up of new wafers to minimize programming time. Features such as bump height, diameter, absence/presence, etc. can easily be selected for inspection through specialized menus.
"This is a landmark order for RVSI for two reasons," said Frank L. Jacovino, General Manager of Wafer Level Products at RVSI Electronics in Hauppauge, New York. "First, the WS-3000 is RVSI's third generation of bumped wafer inspection systems. As the semiconductor industry gradually switches over to 300mm wafers from the current 200mm standard, it is the WS-3000 that will emerge as the flagship product for this industry. Second, with the purchase of a WS-series system by each of the world's largest assembly subcontractors that have entered into flip chip assembly services business, the RVSI WS series has clearly become the industry standard for metrology. In fact, this order is repeat business, and thus represents the continuation of RVSI as the metrology standard as we transition to the 300mm era."
Mr. Jacovino said the new order enhances the opportunity to establish RVSI's product as the industry standard in wafer inspection. "In 1991, we sold the first 3-D lead scanning equipment to the semiconductor industry and established ourselves as the leader in that market segment, a position we continue to hold today with an installed base of more that 1600 systems. Our goal is to replicate that success in wafer inspection as the market for such products develops."
"We won this order in head-to-head competition against the latest product offering from our competitors," he said. "We were told we won on the strength of our unique combination of high accuracy 2-D and 3-D scanning at production speeds."
Robotic Vision Systems, Inc. (RVSI) (NASDAQ:ROBV) has the most comprehensive line of machine vision systems available today. Headquartered in Canton, Massachusetts, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and media transfer equipment. Using leading-edge technology, RVSI joins vision-enabled process equipment, high-performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Currently serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds approximately 100 patents in a broad range of technologies.
Forward Looking Statement
Except for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company's accounting policies and other risk factors detailed in the Company's most recent registration statement, annual report on Form 10-K and 10K/A, and other filings with the Securities and Exchange Commission.
For further information contact:
Neal H. Sanders
5 Shawmut Road
Canton, MA 02021
Tel: 781-302-2439 Fax: 781-302-2440