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Cutting Thick Glass with a Laser
Laser Components USA, Inc. Posted 09/19/2019
LASER COMPONENTS USA, specialized provider of components and services in the laser and optoelectronics industry, presents Holo/OR’s DeepCleave module, a completely optical solution for cutting transparent materials, such as flat panels for mobile phones. A system of lenses with a diffractive optical element is used to focus a single-mode laser beam and create a stretched focus line of 2 mm in beam direction (Z-axis). This 1.8 µm diameter area features uniform intensity distribution.
Embedded in a tube, the DeepCleave system corresponds to a lens with a numerical aperture of 0.35 and can be used immediately. Additional lenses or expensive optics are not required. Together with a DOE from Holo/OR, the DeepCleave module also comprises the sophisticated optical system required to generate the long focal line with constant power density. To achieve this, an input beam with a precisely defined size and a small M² is required.
In mass production of glass for cell phones, displays, solar cells and other high-end -applications¬, long, precise cuts have to be made within a very short time. Cut rates of over 500 mm per second are not uncommon, with cut quality having a decisive influence on the flexibility and durability of the resulting components. Lasers with a uniform line on the Z-axis can penetrate deep into the material and deliver optimum results.
Further product information can be found here.