Raw wafer inspection for micro cracks, geometry and surface
Model Number: VINSPECsolar WIS
VINSPECsolar WIS systems are designed for inspection of raw wafers, as the final step in wafer production or as first step in cell lines. There are different setups for visible light and infrared inspection.
One system inspects geometrical properties, including edge irregularities and detects surface defects using visible light inspection for measurement and classification. The other system is dedicated to micro cracks using infrared light. Different versions are offered for on-the-fly or standstill handling.
VINSPECsolar WIS inspects various formats of wafers with edge lengths of up to six inches (optionally eight inches) whether the cell structure is mono or multi crystalline. All VINSPECsolar systems have proven to be robust and reliable.
“Visible light” wafer inspection: • Geometry/symmetry • Corner and edge breakage • Chipping • Saw marks • Surface defects (marks, stains, dirt, fractures) • Inclusions • Holes
Micro crack inspection: • Micro cracks • Saw marks • Inclusions • Holes, breakage • Decorated grain boundaries • Corner and edge breakage
Our hardware integrates smoothly into your wafer lines. Each system comprises of a sensor and a computing subsystem for integration into established product handling systems. Our software suits your needs for mass production. The tools are optimized for fast and reliable detection of relevant features, according to process and material specific demands. All different VINSPECsolar camera stations within the same production share the same software and a common recipe. They can be managed at any station. The inspection software and the graphical user interface may be tailored to specific customer requirements. The interface allows various views and a visualization of all quality relevant features for current and recently tested cells.
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